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世界读书日 \\ 热管理领域书籍推介

2022-4-23 14:11| 发布者: admin| 查看: 496| 评论: 0|来自: 公众号:热管理材料

摘要: 4月23日是世界读书日,汇总部分热管理领域的相关书籍,供参考学习。目录01、国际信息工程先进技术译丛:先进封装材料02、Advanced Thermal Management Materials03、Advanced Materials for Thermal Management of E ...


4月23日是世界读书日,汇总部分热管理领域的相关书籍,供参考学习。


目录

01、国际信息工程先进技术译丛:先进封装材料

02、Advanced Thermal Management Materials

03、Advanced Materials for Thermal Management of Electronic Packaging

04、Thermal Management of Gallium Nitride Electronics

05、电子设备热设计

06、Advanced Thermal Design of Electronic Equipment

07、印制电路板(PCB)热设计

08、Thermal Management Handbook: For Electronic Assemblies

09、传热学:电力电子器件热管理

10、微电子系统热管理

11、Thermal Management of Microelectronic Equipment

12、集成电路热管理:片上和系统级的监测及冷却

13、Thermal Design of Liquid Cooled Microelectronic Equipment

14、电动汽车动力电池热管理技术

15、中国新能源汽车热管理技术发展

16、Heat Pipe Science and Technology

17、Handbook of Thermal Management of Engines

18、热力学(第二版)

19、Thermal Sciences: An Introduction to Thermodynamics, Fluid Mechanics, and Heat Transfer

20、Fundamentals of Statistical and Thermal Physics

21、Thermodynamics and An Introduction To Thermostatistics

22、Fundamentals of thermodynamics

23、Incroperas Principles Of Heat And Mass Transfer

24、ANSYS Icepak电子散热基础教程




作者:[美] 吕道强(Daniel Lu), 汪正平(C.P.Wong)编,陈明祥,尚金堂 译

《国际信息工程先进技术译丛:先进封装材料》综述了先进封装技术的发展,包括三维(3D)封装、纳米封装、生物医学封装等新兴技术,并重点介绍了封装材料与工艺方面的进展。本书适合微电子、集成电路制造行业的工程技术人员阅读使用,也可作为高等院校相关的研究生和教师的参考用书。



作者:Guosheng Jiang, Liyong Diao, Ken Kuang

《Advanced Thermal Management Materialsprovides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.



作者:[美] Xingcun Colin Tong(仝兴存),安兵,吕卫文,吴懿平 译

《Advanced Materials for Thermal Management of Electronic Packaging》,Covers ceramics and glasses, polymers, metals, metallic composites, multi-material laminates, carbonaceous materials, and carbon-matrix composites. Provides the reader with a comprehensive understanding of thermal management solutions. Includes fundamentals of heat transfer and materials characterization techniques.


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